Nano-CMOS thermal sensor design optimization for efficient temperature measurement

نویسندگان

  • Oghenekarho Okobiah
  • Saraju P. Mohanty
  • Elias Kougianos
چکیده

We present a novel and efficient thermal sensor design methodology. The growing demand for power management on VLSI systems drives the need for accurate thermal sensors. Conventional design techniques for on-chip thermal sensors in nanometer technologies consume expensive design iterations and result in increased power consumption and area overhead. Power-efficient, high-sensitivity thermal sensors are important for reducing the thermal stress on the systems or circuits which are being monitored. The proposed design flow methodology, which incorporates a stochastic gradient descent (SGD) algorithm, optimizes the power consumption (including leakage) of IC subsystems. An illustration of the proposed design methodology is presented using a ring oscillator (RO) based on-chip thermal sensor which was designed using 45 nm CMOS technology. The RO based thermal sensor has a resolution of 0.097°C/bit. Experimental tests and analysis of the design methodology on a full layout-accurate parasitic netlist of the RO demonstrate the applicability of our methodology towards optimization of the power consumption with temperature resolution as a design constraint. A reduction of power consumption by 52% with a final area of 1389.1μm

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Geostatistical-inspired fast layout optimisation of a nano-CMOS thermal sensor

Continuous and aggressive scaling of semiconductor technology has led to persistent and dominant nanoscale effects on analog/mixed-signal (AMS) circuits. Design space exploration and optimization costs using conventional techniques have increased to infeasible levels. Hence, growing research for alternative design and metamodeling techniques with a much reduced design space exploration and opti...

متن کامل

Thermal Effects in Design of Integrated CMOS MEMS High Resolution Pressure Sensor

Thermal effects in integrated piezoresistive MEMS pressure sensor may be a problem of concern in design for applications requiring high precision measurements and in continuously monitoring array of sensor network. It not only results in the shift of the offset voltage of the pressure sensor but also affects the performance of the adjacent CMOS circuit leading to erroneous values. To address th...

متن کامل

Characterization of MOSFET temperature sensors for on-chip dynamic thermal measurements

This work analyses the performance of MOSFETs as a temperature sensor for the measurement of AC on-chip thermal signals caused by a power-dissipating circuit under test (CUT). First, we characterize how the CUT-sensor thermal coupling depends on the frequency of the AC thermal signal and the CUT-sensor distance. Second, we characterize how the thermal sensitivity of the sensor depends on the bi...

متن کامل

ISSCC 2009 / SESSION 20 / SENSORS AND MEMS / 20 . 8 20 . 8 A 0 . 25 μ m Logarithmic CMOS Imager for Emissivity -

Challenges in the design of solid-state imagers for industrial measurement and control include: high image resolution, wide temperature range, adequate temperature resolution, high measurement speed, thermal stability of the sensor chip, and most importantly, low cost. However, they have the inherent disadvantage that their temperature information is strongly dependent on the emissivity of the ...

متن کامل

Meeting Chairs

ELECTRONIC AND OPTICAL MATERIALS A: Amorphous and Polycrystalline Thin-Film Silicon Science and Technology B: Concepts in Molecular and Organic Electronics C: CMOS Gate-Stack Scaling—Materials, Interfaces, and Reliability Implications D: Materials, Processes, and Reliability for Advanced Interconnects for Microand Nano-Electronics E: Science and Technology of Chemical Mechanical Planarization F...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

عنوان ژورنال:
  • Integration

دوره 47  شماره 

صفحات  -

تاریخ انتشار 2014